ASTRONi反應氣體發(fā)生器基于的低場環(huán)形等離子體技術(shù)，可提供更大范圍的工作壓力，同時保持較高的輸入氣體解離率。高可靠性、經(jīng)過現(xiàn)場驗證的設(shè)計架構(gòu)結(jié)合了電源、控制模塊和等離子體室。其結(jié)果是一個緊湊的，蓋子安裝的單位，這是很容易集成。

詳細介紹

立即聯(lián)系何經(jīng)理：AX--47768 AMAT HDP CVD MKS 反應氣體發(fā)生器消除了加工過程中對氬氣的需求

ASTRON®i反應氣體發(fā)生器專為提高流動能力和工藝靈活性而設(shè)計。ASTRONi反應氣體發(fā)生器消除了加工過程中對氬氣的需求，允許選擇與現(xiàn)有工藝氣體兼容的點火氣體，并增加了總體流量，減少了加工時間，提高了吞吐量。
ASTRONi反應氣體發(fā)生器基于的低場環(huán)形等離子體技術(shù)，可提供更大范圍的工作壓力，同時保持較高的輸入氣體解離率。高可靠性、經(jīng)過現(xiàn)場驗證的設(shè)計架構(gòu)結(jié)合了電源、控制模塊和等離子體室。其結(jié)果是一個緊湊的，蓋子安裝的單位，這是很容易集成。
ASTRONi反應氣體發(fā)生器的主要應用是作為反應氣體的遠程源，用于清除CVD或FPD工藝室內(nèi)壁上不需要的沉積物，這些工藝室需要更大的工藝靈活性。通過產(chǎn)生氟原子，與室內(nèi)的廢物沉積發(fā)生反應，形成新的氣體，這些氣體很容易被洗滌，以盡量減少對環(huán)境的影響。此外，與原位射頻方法相比，遠程源減少了對工藝室的磨損。

?操作過程中不需要氬氣
?增加流量減少腔室清潔時間
?連續(xù)運行(CW)，不受占空比限制，支持大型腔室和/或長時間清潔
?兼容200mm和300mm腔室

選擇點火氣體的靈活性和較低的CoO
?緊湊，蓋子安裝設(shè)計，便于集成
?在寬壓力范圍內(nèi)的高解離率，更強大的操作與室清潔硬件配置

AX--47768 AMAT HDP CVD

The ASTRON®i reactive gas generator is designed for increased flow capability and process flexibility. The ASTRONi reactive gas generator eliminates the need for argon during processing, allows a choice of ignition gas compatible with existing process gases, and increases overall flow for decreased processing time and increased throughput.
Based on patented Low-Field-Toroidal plasma technology, the ASTRONi reactive gas generator provides a broader range of operating pressures while maintaining a high input gas dissociation rate. The high reliability, field-proven design architecture combines the power source, control module, and plasma chamber. The result is a compact, lid-mountable unit, which is easy to integrate.
The primary application for the ASTRONi reactive gas generator is as a remote source for reactive gas to clean undesired deposits from interior walls of CVD or FPD process chambers where greater process flexibility is required. By generating atomic fluorine that reacts with waste deposits in the chamber, new gases are formed that are readily scrubbed to minimize the environmental impact. In addition, the remote source reduces wear and tear on the process chamber compared to in situ RF methods.

? No Argon required during operation
? Increased flow reduces chamber clean time
? Continuous operation (CW), not duty cycle limited, to support large chambers and/or long clean times
? Compatible with 200mm and 300mm chambers

Choice of ignition gases for flexibility and lower CoO
? Compact, lid-mountable design, for easy integration
? High dissociation rate over broad pressure range for more robust operation with chamber clean hardware configurations

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