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目錄:廣電計量檢測集團股份有限公司>>元器件篩選及失效分析>>AEC-Q認證測試>> AEC-Q102產(chǎn)品試驗,光電器件車規(guī)級認證
| 服務區(qū)域 | 全國 | 服務周期 | 2-3個月 |
|---|---|---|---|
| 服務資質 | CMA/CNAS | 服務費用 | 視具體項目而定 |
服務背景
由福特、克萊斯勒、通用組成的汽車電子委員會（AEC）頒布了光電器件的可靠性標準AEC-Q102，對光電器件的可靠性展開了嚴格的測試要求，為主機廠提供了可靠性高、使用壽命長的光電器件。廣電計量AEC-Q技術團隊，執(zhí)行過大量的AEC-Q測試案例，積累了豐富的認證試驗經(jīng)驗，可為您提供更專業(yè)、更可靠的測試服務，同時我們也提供LED、光電二極管、晶體管、激光器件的環(huán)境試驗服務。
| 序號 | 測試項目 | 縮寫 | 樣品數(shù)/批 | 批數(shù) | 測試方法 |
| 1 | Pre- and Post-Stress Electrical and Photometric Test | TEST | 所有應力試驗前后均進行測試 | 用戶規(guī)范 | |
| 2 | Pre-conditioning | PC | SMD產(chǎn)品在WHTOL、TC、PTC試驗前預處理 | JESD22-A113 | |
| 3 | External Visual | EV | 每項試驗前后均進行測試，除DPA和尺寸測試 | JESD22-B101 | |
| 4 | Parametric Verification | PV | 25 | 3 Note A | 用戶規(guī)范 |
| 5a | High Temperature Operating Life | HTOL1 | 26 | 3 Note B | JESD22-A108 |
| 5b | High Temperature Operating Life | HTOL2 | 26 | 3 Note B | JESD22-A108 |
| 5c | High Temperature Reverse Bias | HTRB | 26 | 3 Note B | JESD22-A108 |
| 6a | Wet High Temperature Operating Life | WHTOL1 | 26 | 3 Note B | JESD22-A101 |
| 6b | Wet High Temperature Operating Life | WHTOL2 | 26 | 3 Note B | JESD22-A101 |
| 6c | High Humidity High Temperature Reverse Bias | H3TRB | 26 | 3 Note B | JESD22-A101 |
| 7 | Temperature Cycling | TC | 26 | 3 Note B | JESD22-A104 |
| 8a | Power Temperature Cycling | PTC | 26 | 3 Note B | JESD22-A105 |
| 8b | Intermittent Operational Life | IOL | 26 | 3 Note B | MIL-STD-750-1 Method 1037 |
| 9 | Low Temperature Operating Life | LTOL | 26 | 3 Note B | JESD22-A108 |
| 10a | Electrostatic Discharge Human Body Model | HBM | 10 | 3 | JS-001 |
| 10b | Electrostatic Discharge Charged Device Model | CDM | 10 | 3 | AEC Q101-005 |
| 11 | Destructive Physical Analysis | DPA | 2/試驗 | 1 | Appendix 6 |
| 12 | Physical Dimension | PD | 10 | 3 | JESD22-B100 |
| 13 | Terminal Strength | TS | 10 | 3 | MIL-STD-750-2 Method 2036 |
| 14 | Constant Acceleration | CA | 10 | 3 | MIL-STD-750-2 Method 2006 |
| 15 | Vibration Variable Frequency | VVF | JEDEC JESD22-B103 | ||
| 16 | Mechanical Shock | MS | JEDEC JESD22-B104 | ||
| 17 | Hermeticity | HER | JESD22-A109 | ||
| 18a | Resistance to Solder Heat | RSH (-reflow) | 10 | 3 | 含鉛：JESD22-A113、J-STD-020 |
| 無鉛：AEC-Q005 | |||||
| 18b | Resistance to Solder Heat | RSH (-wave) | 10 | 3 | 含鉛：JESD22-B106 |
| 無鉛：AEC-Q005 | |||||
| 19 | Solderability | SD | 10 | 3 | 含鉛：J-STD-002、JESD22-B102 |
| 無鉛：AEC-Q005 | |||||
| 20 | Pulsed Operating Life | PLT | 26 | 3 | JESD22-A108 |
| 21 | Dew | DEW | 26 | 3 | JESD22-A100 |
| 22 | Hydrogen Sulphide | H2S | 26 | 3 | IEC 60068-2-43 |
| 23 | Flowing Mixed Gas | FMG | 26 | 3 | IEC 60068-2-60 Test method 4 |
| 24 | Thermal Resistance | TR | 10 | 1 | JESD51-50、JESD51-51、JESD51-52 |
| 25 | Wire Bond Pull | WBP | 10 | 3 | MIL-STD-750-2 Method 2037 |
| 26 | Wire Bond Shear | WBS | 10 | 3 | AEC Q101-003 |
| 27 | Die Shear | DS | 5 | 3 | MIL-STD-750-2 Method 2017 |
| 28 | Whister Growth | WG | / | / | AEC Q005 |
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